04162019_TLPS-Product-Catalog_WIP

Sintering Pastes for Electronics Assembly

WHO WE ARE EMD Performance Materials is a Business of Merck KGaA, Darmstadt, Germany 2 Sintering Pastes for Electronics Assembly

With 13 manufacturing and testing facilities around the world, EMD Performance Materials is equipped and staffed to work proactively with customers seeking advanced interconnection materials and applications. Table of Contents: 4 Transient Liquid Phase Sintering (TLPS): An Introduction………….. 5 Z-Axis Interconnect Pastes for High-Density PCBs…………………….. 8 Non-Remelting Solder Pastes………………………………………………….. 11 High-Temperature Stable Conductive Adhesives……………….………. 13 High-Temperature Stable Die-Attach Pastes……………………………… 3 Sintering Pastes for Electronics Assembly

Transient Liquid Phase Sintering (TLPS) An Introduction Transient liquid phase sintering (TLPS) pastes are similar in form, fit and function to conventional lead-free solder pastes. However, unlike solder pastes, TLPS pastes comprise a mixture of high melting point metal powders (Cu, Ag, etc.) and lead-free solder powders (SAC305, SnBi, etc.), within an organic flux vehicle. Upon thermal processing above the reflow temperature of the solder powders, the liquid phase solder reacts with the adherents as well as with the high melting point powders within the paste, driving rapid solidification and the formation of intermetallic compounds and metallurgical connections extending across the bondline. Since the sintering reaction is assisted by a tin-based liquid phase, the formation of metallurgical connections at solderable interfaces are achieved using conventional assembly and processing equipment (reflow and/or batch-ovens), and almost any solderable metallization is suitable. When formulated for high temperature stability, alloy formation can be driven to consume the entirety of the low-melting point solder phase during reflow, rendering an intermetallic network with excellent thermomechanical stability out to beyond 350°C, far higher than the original melting point of the lead-free solder (218°C) and the peak processing temperature (235°C). This is shown in Figure 2 in the Differential Scanning Calorimetry (DSC) scans. Initially, the solder component is shown to melt at 218°C, however after a 5-minute dwell at 235°C, no sign of the initial solder is left. There is no re- melting; the material can undergo additional reflows without change in characteristics. 4 Sintering Pastes for Electronics Assembly

Pb-Free Electronics Assembly Z-AXIS Interconnects for High-Density Printed Circuit Boards Featuring Transient Liquid Phase Sintering (TLPS) Z-Axis interconnects are rad because… Sintering Pastes for Electronics Assembly

technical datasheet Ormet®PCB-710 Pb-Free Printed Circuit Board Via Filling Paste PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS Ormet PCB-710 is a Pb-free paste formulated for filling microvias within printed circuit boards. Ormet PCB-710 filling PROPERTY UNIT OF TYPICAL paste is designed for stacked vias to form vertical MEASURE VALUE interconnects allowing PCB designers to maximize circuit density and minimize the number of lamination cycles required Paste Color Visual Copper to manufacture high layer count PCB’s. It is specifically “As designed for use in applications that require stable electrical Received” Copper continuity over a large operating temperature range. Ormet + Tin Alloy PCB-710 is a moderately low viscosity formulation capable of Filler Type filling blind microvias with aspect rations of less than 1:1 with <25 stencil printing. Ormet Transient Liquid Phase Sintering Nominal Micron (TLPS) pastes use patented technology that allow PCB’s to be Particle Size 430 manufactured at common lamination temperatures in a Viscosity @ 5 Brookfield parallel, rather than a sequential process flow, resulting in RPM, kcps TE Spindle 3.5 complex assemblies in high yield. After sintering, the Ormet Thixotropic PCB-710 can withstand temperatures above 400°C without Index Slope 4 re-melting, allowing for subsequent component assembly with Work Life at 1:10 rpm outstanding reliability. 25°C 12 Storage Life, Hours < -10°C Months FEATURES AND ADVANTAGES POST-SINTERED CHARACTERISTICS • Desired filling diameters: <200um with <1:1 aspect ratio PROPERTY UNIT OF TYPICAL • Ability to extend high aspect ratio, plated through holes MEASURE VALUE while maintaining standard drill techniques Metal weight percent • Enables blind and buried vias while reducing lamination Loading 93 cycles μΩ*cm 30 Volume • Via-in-pad design interconnects in multi-layer substrates Resistivity • Stable electrical resistance over time and temperature Coefficient Thermal ppm/C 22 DEPOSITION GUIDELINES Expansion Ormet PCB-710 can be applied by several techniques but most typically using a printing process with a polyester-based stencil, fabricated with a laser-drilling process, to match via locations within the PCB. Ormet PCB-710 is typically applied into blind vias that have been laser ablated into a polymer coversheet and prepreg/adhesive tack-laminated onto a circuit layer. A 60-80 durometer polymer blade is used to force the paste into the blind hole, followed by a metal squeegee blade for a level finish. To ensure a full fill a second coat may be applied with the metal squeegee after a heated settling stage. After filling is complete, the polymer cover is removed to prepare the panel for lamination. SINTERING METHOD This paste provides the electrical interconnection during lamination while the prepreg or adhesive layer crosslinks to form the mechanical properties of the substrate or printed circuit board. A two-stage process is recommended to avoid solvent entrapment in the assembly. (See Table 1 for details). Please consult with your EMD Performance Materials Account Representative for additional processing guidelines for selected prepreg/adhesives. RECOMMENDED SINTERING PROFILE THERMAL PREFERRED ALTERNATE OPERATION PROFILE PROFILE Solvent Removal 30 min @ 95°C 20 min @ 115°C (Drying) 60 min @ 75°C 6 Follow prepreg manufacturer’s recommended lamination cycle Sintering Sintering Pastes for Electronics Assembly

technical datasheet Ormet®PCB-701 Pb-Free Printed Circuit Board Via Filling Paste PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS Ormet PCB-701 is a lead-free conductive paste used to fill micro via structures that create z-axis interconnections PROPERTY UNIT OF TYPICAL between circuit layers in semiconductor packaging and printed MEASURE VALUE circuit boards. The innovative metal matrix incorporates Ormet Circuits’ patented Transient Liquid Phase Sintering (TLPS) Paste Color Visual Copper technology to make robust, reliable via structures and “As interconnects. Ormet Circuits’ TLPS compounds enable lead- Received” Copper free metallic bonding at temperatures as low as 175°C. The + Tin Alloy metallurgy of Ormet PCB-701 was specifically designed to Filler Type maintain low and stable resistance in micro via applications and <25 lead-free component assembly cycles. Nominal Micron Particle Size 430 FEATURES AND ADVANTAGES Viscosity @ 5 Brookfield Ormet PCB-701 is used in via fill applications to increase yield RPM, kcps TE Spindle 3.5 and reduce product manufacturing time. Some applications that Thixotropic may be candidates for Ormet PCB-701 include: Index Slope 4 Work Life at 1:10 rpm • Filling high-aspect ratio holes (down to 50um in diameter) 25°C 12 where plating is a time consuming and low yield process Storage Life, Hours < -10°C • Enabling the placement of blind and buried vias in Months multilayer substrates at lower cost and at a higher throughput and yield than sequential copper plating POST-SINTERED CHARACTERISTICS • Interconnecting layers in via-in-pad PCB applications PROPERTY UNIT OF TYPICAL MEASURE VALUE RECOMMENDED SINTERING PROFILE Metal weight 93 Loading percent 30 THERMAL PREFERRED ALTERNATE μΩ*cm 22 PROFILE Volume OPERATION PROFILE 30 min Resistivity ppm/C @ 50°C Settle (Removal of Coefficient 10 min Thermal any entrapped air 15 min @ 75°C Expansion 20 min from bottom of blind @ 60°C @115°C 60 min via) @ 75°C 15 min @ 210°C DEPOSITION GUIDELINES Solvent Removal 30 min Ormet PCB-710 can be applied by several (Drying) @ 95°C techniques but most typically using a printing process with a polyester-based Sintering and 60 min stencil, fabricated with a laser-drilling Lamination @ 190°C process, to match via locations within the PCB. Ormet PCB-710 is typically applied SINTERING METHOD into blind vias that have been laser ablated This paste provides the electrical interconnection during lamination while the prepreg or adhesive layer crosslinks to into a polymer coversheet and form the mechanical properties of the substrate or printed circuit board. A two-stage process is recommended to avoid prepreg/adhesive tack-laminated onto a solvent entrapment in the assembly. (See Table 1 for details). Please consult with your EMD Performance circuit layer. A 60-80 durometer polymer Materials Account Representative for additional processing guidelines for selected prepreg/adhesives. blade is used to force the paste into the blind hole, followed by a metal squeegee blade for a level finish. To ensure a full fill a second coat may be applied with the metal squeegee after a heated settling stage. After filling is complete, the polymer cover is removed to prepare the 7 panel for lamination. Sintering Pastes for Electronics Assembly

Pb-Free Electronics Assembly Non-Remelting Solder Pastes Featuring Transient Liquid Phase Sintering (TLPS) To address the growing complexity of assembling today’s electronics packages, EMD Performance Materials has developed a portfolio of high-performance and user-friendly solder pastes featuring Ormet® Transient Liquid Phase Sintering (TLPS) technology. In a nearly identical manner to the way that conventional solder pastes are utilized in electronics assembly, TLPS pastes are also utilized while rendering a uniquely distinct benefit…TLPS solder pastes do not re-melt. Like conventional solders pastes, TLPS pastes are composed of very-fine particles suspended in a fluxing medium. Unlike conventional solder pastes, whose particle compositions are made up of a single tin-based alloy that all melt at the same temperature, the particle compositions in a TLPS paste are a mixture of low-melting point metals (tin-based) and high-melting point metals (copper-based). When TLPS pastes are thermally processed (re-flowed), the molten tin rapidly reacts with the solid copper particles and solidifies to form thermally stable copper-tin alloy interconnections with very high melting temperatures (>350°C). This enables assemblies that can undergo many additional reflow steps with no change to the TLPS bond performance. Sintering Pastes for Electronics Assembly

preliminary technical datasheet Ormet®XCAP-823-1 Pb-Free & Non-Remelting Solder Paste PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS Ormet XCAP-823-1 is a Pb-free paste formulated for system- in-package (SiP) assembly applications and specifically PROPERTY UNIT OF TYPICAL designed for use in applications with a wide variety of MEASURE VALUE components. Ormet XCAP-823-1 is a high thixotropy, low- Paste Color Visual Copper bleed formulation which exhibits outstanding performance in “As Received” Copper fine line/space, high-density applications where extra bond Micron + Tin Alloy strength is required. Ormet Transient Liquid Phase Filler Type Malcolm Sintering (TLPS) pastes use patented technology that allow <33 assemblies to be manufactured at low temperatures, resulting Nominal Hours in packages with a broad range of operating temperatures. Particle Size 170 After sintering, Ormet XCAP-823-1 can withstand Viscosity @ 10 temperatures above 400°C without re-melting, allowing for RPM, Pa.s 24 subsequent reflows with outstanding reliability. Work Life at 25°C FEATURES AND ADVANTAGES Storage Life, Months 12 Ormet XCAP-823-1 < -10°C • Low bleed/slump formulation for tighter component spacing POST-SINTERED CHARACTERISTICS • Reduced alloy size w/smaller voids PROPERTY UNIT OF TYPICAL • High operating temperatures MEASURE VALUE • Excellent volume resistivity Metal Loading weight 92 • Excellent thermal conductivity percent 24 Volume μΩ*cm 20 DEPOSITION GUIDELINES Resistivity Ormet XCAP-823-1 is designed for stencil printing using Effective W/m-K 22 standard SMT printing equipment. Thermal 4.0 Typical printing parameters are: Conductivity ppm/C 2.2 • Stencil: SS or E-Formed, Ni-Plated Coefficient • Stencil Thickness: 0.003” Thermal kg/mm2 • Aperture Reduction: 5-20% Expansion kg/mm2 • Squeegee: Stainless Steel Shear Strength, • Squeegee Angle: 60 degrees 25°C • Squeegee Speed: 0.75 in/s Shear Strength, 260°C • Squeegee Force: 1.0-1.25 lb/linear inch Recommended Reflow Profile • Stencil Life STP & RH: 4 hours SINTERING METHOD Ormet XCAP-823-1 is designed to be sintered in an inert environment with an oxygen content less than 500 ppm and a dwell temperature of 220°C (or greater) for a minimum of 60 seconds. An SMT reflow oven or a two-stage box oven process can be used to achieve desired performance. A recommended reflow profile is shown in the figure to the right. 9 Sintering Pastes for Electronics Assembly

preliminary technical datasheet Ormet®XCAP-406A Pb-Free & Non-Remelting Solder Paste PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS Ormet XCAP-406A is a Pb-free paste formulated for system- in-package (SiP) assembly applications and specifically PROPERTY UNIT OF TYPICAL designed for use in applications with a wide variety of MEASURE VALUE components. Ormet XCAP-406A is a high thixotropy, low- slump formulation which exhibits outstanding performance in Paste Color Visual Copper high-density applications where extra bond strength is “As Received” Copper required. Ormet Transient Liquid Phase Sintering (TLPS) Micron + Tin Alloy pastes use patented technology that allow assemblies to be Filler Type Malcolm <40 manufactured at low temperatures, resulting in assemblies with a broad range of operating temperatures. After sintering, the Nominal Hours 166 Ormet XCAP-406A can withstand temperatures above 400°C Particle Size without re-melting, allowing for subsequent reflows with Viscosity @ 10 24 outstanding reliability. RPM, Pa.s Work Life at 25°C FEATURES AND ADVANTAGES Storage Life, Months 12 Ormet XCAP-406A < -10°C • High operating temperatures POST-SINTERED CHARACTERISTICS • Outstanding thermal conductivity • Extremely slump resistant PROPERTY UNIT OF TYPICAL • High shear strength MEASURE VALUE • Excellent electrical conductivity Metal Loading weight 93 percent 30 DEPOSITION GUIDELINES Volume μΩ*cm 20 Ormet XCAP-406A is designed for stencil printing using Resistivity standard SMT printing equipment. Effective W/m-K 22 Thermal <5 Typical printing parameters are: Conductivity ppm/C 4.0 • Stencil: E-Formed, Ni-Plated Coefficient • Aperture Reduction: 20% Thermal kg/mm2 • Squeegee: Stainless Steel Expansion kg/mm2 • Squeegee Angle: 60 degrees Shear Strength, • Squeegee Speed: 1.5 in/s 25°C • Squeegee Force: 1.25 lb/linear inch Shear Strength, • Stencil Life STP&RH: 4 hours 260°C SINTERING METHOD Recommended Reflow Profile Ormet XCAP-406A is designed to be sintered in an inert environment with an oxygen content less than 500 ppm and at 220°C (or greater) for a minimum of 60 seconds. An SMT reflow oven or a two-stage box oven process can be used to achieve desired performance. A recommended reflow profile is shown in the figure to the right. 10 Sintering Pastes for Electronics Assembly

Pb-Free Electronics Assembly High-Temperature Stable Conductive Adhesives Featuring Transient Liquid Phase Sintering (TLPS) To address the limitations of traditional silver-filled conductive adhesives in semiconductor thermal management, EMD Performance Materials has developed a 100% solids (no-VOC), high- performance and user-friendly Transient Liquid Phase Sintering (TLPS) conductive adhesive featuring Ormet® technology. In a nearly identical manner to the way that conductive adhesives are utilized in electronics assembly, TLPS adhesives are also utilized while rendering two uniquely distinct benefits: 1. When bonding solderable interfaces, TLPS adhesives form metallurgical connections; 2. Once cured and sintered, thermal stability is driven by the sintered metallurgy and not the glass-transition (Tg) of the adhesive binder. Like conventional conductive adhesives, TLPS adhesives are composed of very-fine particles suspended in an adhesive binder at very high loading levels (>85wt%). Both are cured at moderate temperatures (≤200°C). Unlike conventional conductive adhesives, whose electrical and thermal conductivity is driven by point-to-point contact between silver powders and flakes, TLPS adhesives form metallurgical networks throughout a bond-line, drastically reducing the thermal resistance when compared to conventional conductive adhesives. Sintering Pastes for Electronics Assembly

preliminary technical datasheet Ormet®XDAP-470 High-Conductivity and High-Temperature Conductive Adhesive PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS The Ormet XDAP-470 is a Pb-free, sintering adhesive formulated for attachment of bare or PROPERTY UNIT OF TYPICAL metalized die to metalized lead frame substrates. The MEASURE VALUE XDAP-470 is processed at a relatively low sintering Filler Type temperature (≤200°C), but then exhibits high Micron Ag, Cu, Sn & thermal stability and can withstand subsequent lead- Nominal cPs Bi Alloy free reflow temperatures above 260°C without re- Particle Size 0.5/5 <25 melting. Viscosity at 5 RPM, Hours 17,000 The Ormet XDAP 470 paste is an excellent CP51 Months alternative to solder or silver filled adhesives for Thixotropic 3 electronic packaging applications requiring excellent Index electrical and thermal conductivity. Work Life at 12 25°C FEATURES AND ADVANTAGES Storage 6 Ormet XDAP-470 Life, -40°C • Solvent free, low void adhesive formulation • Minimal bleed out POST-SINTERED CHARACTERISTICS • Outstanding dispensability through small PROPERTY UNIT OF TYPICAL diameter needles MEASURE VALUE • Excellent adhesion to bare or metalized die • Capable of withstanding multiple, lead-free Volume μΩ*cm 50 Resistivity 15 reflow profiles Effective W/mK Thermal 22 DEPOSITION GUIDELINES Conductivity ppm/C <2% Ormet XDAP-470 is designed for syringe dispense Coefficient weight using traditional time pressure equipment or auger Thermal percent 2 value dispensing systems. Expansion kg/mm2 Thermal Typical printing parameters are: Gravimetric Loss • Needle Diameter: 22-25 gauge Die Shear • Pressure: 30 psi Strength, 25 C° • Work Life: 12 hrs @ 30-60% RH and RT SINTERING & CURE PROFILE The Ormet paste sintering should be performed with a 5°C/min ramp to 200°C for 60 minutes. Although the adhesive can be cured in air, the recommended process is to utilize a nitrogen-purged (or inert) environment to minimize oxidation. 12 Sintering Pastes for Electronics Assembly

Pb-Free Electronics Assembly High-Temperature Stable Die-Attach Pastes Featuring Transient Liquid Phase Sintering (TLPS) To address the utilization of high-lead solders in power semiconductor die-attach, EMD Performance Materials has developed high-conductivity, high-temperature stable and user- friendly Transient Liquid Phase Sintering (TLPS) die-attach pastes featuring Ormet® technology. In a nearly identical manner to the way that solders are used in semiconductor assembly, TLPS die-attach pastes are also utilized while rendering a uniquely distinct benefit…TLPS die-attach pastes do not re-melt. Like conventional solders pastes, TLPS pastes are composed of very-fine particles suspended in a fluxing medium. Unlike conventional solder pastes, whose particle compositions are made up of a single tin-based alloy that all melt at the same temperature, the particle compositions in a TLPS paste are a mixture of low-melting point metals (tin-based) and high-melting point metals (copper-based). When TLPS pastes are thermally processed (re-flowed), the molten tin rapidly reacts with the solid copper particles and solidifies to form thermally stable copper-tin alloy interconnections with very high melting temperatures (>350°C). This enables assemblies that can undergo many additional reflow steps with no change to the TLPS bond performance. Sintering Pastes for Electronics Assembly

preliminary technical datasheet Ormet®XDAP-481-1 Pb-Free & Non-Remelting Die-Attach Paste PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS Ormet XCAP-823-1 is a Pb-free paste formulated for system- in-package (SiP) assembly applications and specifically PROPERTY UNIT OF TYPICAL designed for use in applications with a wide variety of MEASURE VALUE components. Ormet XCAP-823-1 is a high thixotropy, low- Paste Color Visual Copper bleed formulation which exhibits outstanding performance in “As Received” Copper fine line/space, high-density applications where extra bond Micron + Tin Alloy strength is required. Ormet Transient Liquid Phase Filler Type Malcolm Sintering (TLPS) pastes use patented technology that allow <33 assemblies to be manufactured at low temperatures, resulting Nominal Hours in packages with a broad range of operating temperatures. Particle Size 170 After sintering, Ormet XCAP-823-1 can withstand Viscosity @ 10 temperatures above 400°C without re-melting, allowing for RPM, Pa.s 24 subsequent reflows with outstanding reliability. Work Life at 25°C FEATURES AND ADVANTAGES Storage Life, Months 12 Ormet XCAP-823-1 < -10°C • Low bleed/slump formulation for tighter component spacing POST-SINTERED CHARACTERISTICS • Reduced alloy size w/smaller voids PROPERTY UNIT OF TYPICAL • High operating temperatures MEASURE VALUE • Excellent volume resistivity Metal Loading weight 92 • Excellent thermal conductivity percent 24 Volume μΩ*cm 20 DEPOSITION GUIDELINES Resistivity Ormet XCAP-823-1 is designed for stencil printing using Effective W/m-K 22 standard SMT printing equipment. Thermal 4.0 Typical printing parameters are: Conductivity ppm/C 2.2 • Stencil: SS or E-Formed, Ni-Plated Coefficient • Stencil Thickness: 0.003” Thermal kg/mm2 • Aperture Reduction: 5-20% Expansion kg/mm2 • Squeegee: Stainless Steel Shear Strength, • Squeegee Angle: 60 degrees 25°C • Squeegee Speed: 0.75 in/s Shear Strength, 260°C • Squeegee Force: 1.0-1.25 lb/linear inch Recommended Reflow Profile • Stencil Life STP & RH: 4 hours SINTERING METHOD Ormet XCAP-823-1 is designed to be sintered in an inert environment with an oxygen content less than 500 ppm and a dwell temperature of 220°C (or greater) for a minimum of 60 seconds. An SMT reflow oven or a two-stage box oven process can be used to achieve desired performance. A recommended reflow profile is shown in the figure to the right. 14 Sintering Pastes for Electronics Assembly

preliminary technical datasheet Ormet®XDAP-523B Pb-Free & Non-Remelting Die-Attach Paste PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS Ormet XCAP-823-1 is a Pb-free paste formulated for system- in-package (SiP) assembly applications and specifically PROPERTY UNIT OF TYPICAL designed for use in applications with a wide variety of MEASURE VALUE components. Ormet XCAP-823-1 is a high thixotropy, low- Paste Color Visual Copper bleed formulation which exhibits outstanding performance in “As Received” Micron fine line/space, high-density applications where extra bond Copper strength is required. Ormet Transient Liquid Phase Filler Type + Tin Alloy Sintering (TLPS) pastes use patented technology that allow assemblies to be manufactured at low temperatures, resulting Nominal <33 in packages with a broad range of operating temperatures. Particle Size After sintering, Ormet XCAP-823-1 can withstand Viscosity @ 10 Malcolm 170 temperatures above 400°C without re-melting, allowing for RPM, Pa.s subsequent reflows with outstanding reliability. Work Life at Hours 24 25°C Months 12 FEATURES AND ADVANTAGES Ormet XCAP-823-1 Storage Life, • Low bleed/slump formulation for tighter component < -10°C spacing POST-SINTERED CHARACTERISTICS • Reduced alloy size w/smaller voids PROPERTY UNIT OF TYPICAL • High operating temperatures MEASURE VALUE • Excellent volume resistivity Metal Loading weight 92 • Excellent thermal conductivity percent 24 Volume μΩ*cm 20 DEPOSITION GUIDELINES Resistivity Ormet XCAP-823-1 is designed for stencil printing using Effective W/m-K 22 standard SMT printing equipment. Thermal 4.0 Typical printing parameters are: Conductivity ppm/C 2.2 • Stencil: SS or E-Formed, Ni-Plated Coefficient • Stencil Thickness: 0.003” Thermal kg/mm2 • Aperture Reduction: 5-20% Expansion kg/mm2 • Squeegee: Stainless Steel Shear Strength, • Squeegee Angle: 60 degrees 25°C • Squeegee Speed: 0.75 in/s Shear Strength, 260°C • Squeegee Force: 1.0-1.25 lb/linear inch Recommended Reflow Profile • Stencil Life STP & RH: 4 hours SINTERING METHOD Ormet XCAP-823-1 is designed to be sintered in an inert environment with an oxygen content less than 500 ppm and a dwell temperature of 220°C (or greater) for a minimum of 60 seconds. An SMT reflow oven or a two-stage box oven process can be used to achieve desired performance. A recommended reflow profile is shown in the figure to the right. 15 Sintering Pastes for Electronics Assembly

preliminary technical datasheet Ormet®XDAP-527-1 Pb-Free & Non-Remelting Die-Attach Paste PRODUCT DESCRIPTION PRE-SINTERED CHARACTERISTICS Ormet XCAP-823-1 is a Pb-free paste formulated for system-in-package (SiP) assembly applications and PROPERTY UNIT OF TYPICAL specifically designed for use in applications with a wide MEASURE VALUE variety of components. Ormet XCAP-823-1 is a high thixotropy, low-bleed formulation which exhibits outstanding Paste Color “As Visual Copper performance in fine line/space, high-density applications Received” Copper where extra bond strength is required. Ormet Transient Micron + Tin Alloy Liquid Phase Sintering (TLPS) pastes use patented Filler Type Malcolm technology that allow assemblies to be manufactured at low <33 temperatures, resulting in packages with a broad range of Nominal Hours operating temperatures. After sintering, Ormet XCAP-823- Particle Size Months 170 1 can withstand temperatures above 400°C without re- Viscosity @ 10 melting, allowing for subsequent reflows with outstanding RPM, Pa.s 24 reliability. Work Life at FEATURES AND ADVANTAGES 25°C 12 Ormet XCAP-823-1 Storage Life, • Low bleed/slump formulation for tighter component < -10°C spacing POST-SINTERED CHARACTERISTICS • Reduced alloy size w/smaller voids PROPERTY UNIT OF TYPICAL • High operating temperatures Metal Loading MEASURE VALUE • Excellent volume resistivity • Excellent thermal conductivity weight 92 percent DEPOSITION GUIDELINES Volume μΩ*cm 24 20 Ormet XCAP-823-1 is designed for stencil printing using Resistivity 22 standard SMT printing equipment. Effective Thermal W/m-K 4.0 Typical printing parameters are: Conductivity 2.2 • Stencil: SS or E-Formed, Ni-Plated Coefficient • Stencil Thickness: 0.003” Thermal ppm/C • Aperture Reduction: 5-20% Expansion kg/mm2 • Squeegee: Stainless Steel kg/mm2 • Squeegee Angle: 60 degrees Shear Strength, • Squeegee Speed: 0.75 in/s 25°C • Squeegee Force: 1.0-1.25 lb/linear inch Shear Strength, • Stencil Life STP & RH: 4 hours 260°C Recommended Reflow Profile SINTERING METHOD Ormet XCAP-823-1 is designed to be sintered in an inert environment with an oxygen content less than 500 ppm and a dwell temperature of 220°C (or greater) for a minimum of 60 seconds. An SMT reflow oven or a two-stage box oven process can be used to achieve desired performance. A recommended reflow profile is shown in the figure to the right. 16 Sintering Pastes for Electronics Assembly