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Micro Device Hot Solder Dip Brochure

Published by sarah.main, 2021-07-12 07:50:42

Description: Micro Device Hot Solder Dip Brochure


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MICRO DEVICE HOT EXCLUSIVE TO SOLDER DIP RETRONIX A Retronix Process Innovation | Patent Pending TIN WHISKER MITIGATION It’s a well-known fact (there are hundreds of technical papers confirming), that Tin Whisker filaments can grow uncontrollably from tin plating. The ALLOY danger comes when one of these filaments peels away from tin & CONVERSION connects with an adjacent component thus causing a short. The most common method to eliminate tin whiskers is to convert the plating from ‘lead-free’ (tin plating) to tin/lead plating. The process is carried out by simply dipping a component’s terminations into tin-lead solder. High Reliability industries are allowed dispensation to use tin/lead solder, as they cannot run the risk of tin whiskers long term. TINNING MICRO DEVICES New components are sold only in lead-free form & therefore High ALLOY Reliability organisations must convert them to tin/lead, a process that REFRESH has to conform to GEIA standard. The problem is that smaller components such as 0402, 0603, and SOT chip capacitors could not (until now) be handled in an automated process. Hand-dipping has been the only conversion method, which can be costly, time-consuming, does not meet GEIA Standards & has more potential for inconsistent application. Many manufacturers are rejecting hand dipping & instead are assembling PCBs with lead paste. FIND OUT MORE: W: E: [email protected] T: +44 (0) 1236 433 345

LEAD PASTE FAILINGS The consequence of this work around is that the lead solder from the paste only covers the sides of the termination but does not reach the top surface. As widely reported by NASA, this process DOES NOT protect against the risk of Tin Whiskers. Source: THE RETRONIX SOLUTION | MICRO DEVICE HOT SOLDER DIP With the automated process designed exclusively by Retronix (Patent Pending) for tinning micro devices including 0402’s, 0603’s & SOT’s to GEIA standards, the industry finally has an all-inclusive solution for tinning requirements. The automated micro tinning process is carried out on our approved plating systems. The lead-free capacitors are picked up by a specially designed tool that can hold multiple devices at a time. The devices are moved to the fluxing station & then accurately over the solder wave. The pre-programmed automated system ensures the dip is precise & consistent. Thanks to our Micro Device process, lead solder covers ALL sides of capacitor terminations. SIDE VIEW TOP VIEW In many cases, the approach to mirco device tinning has been, “No suitable process that meets GEIA standard exists therefore, it’s not a problem we can fix.” Or companies work around the issue which is not ideal. Now the Retronix Micro Device | Hot Solder Dip process offers an automated solution to tin/ solder even the smallest and most challenging of components to GEIA standard. FIND OUT MORE: W: E: [email protected] T: +44 (0) 1236 433 345

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