TTL_Databook

8-BIT MAGNITUDE SN54/74LS682 COMPARATORS SN54/74LS684 SN54/74LS688 The SN54 / 74LS682, 684, 688 are 8-bit magnitude comparators. These device types are designed to perform comparisons between two eight-bit 8-BIT MAGNITUDE binary or BCD words. All device types provide P = Q outputs and the LS682 COMPARATORS and LS684 have P>Q outputs also. LOW POWER SCHOTTKY The LS682, LS684 and LS688 are totem pole devices. The LS682 has a 20 kΩ pullup resistor on the Q inputs for analog or switch data. 20 J SUFFIX 1 CERAMIC CONNECTION DIAGRAMS (TOP VIEW) CASE 732-03 20 VCC P=Q Q7 P7 Q6 P6 Q5 P5 Q4 P4 1 N SUFFIX 20 19 18 17 16 15 14 13 12 11 PLASTIC 20 CASE 738-03 SN54/74LS682/684 1 DW SUFFIX 1 2 3 4 5 6 7 8 9 10 SOIC P>Q P0 Q0 P1 Q1 P2 Q2 P3 Q3 GND CASE 751D-03 VCC P=Q Q7 P7 Q6 P6 Q5 P5 Q4 P4 20 19 18 17 16 15 14 13 12 11 SN54/74LS688 ORDERING INFORMATION 1 2 3 4 5 6 7 8 9 10 SN54LSXXXJ Ceramic G P0 Q0 P1 Q1 P2 Q2 P3 Q3 GND SN74LSXXXN Plastic SN74LSXXXDW SOIC FUNCTION TABLE INPUTS OUTPUTS OUTPUT OUTPUT DATA ENABLES ENABLE CONFIGURATION TYPE P=Q P>Q totem-pole PULLUP P, Q G, GT G2 P = Q P > Q LS682 yes yes no totem-pole yes LS684 yes yes no totem-pole no P=Q L L L H LS688 yes no yes no P>Q L L H L P<Q L L H H X H HHH H = HIGH Level, L = LOW Level, X = Irrelevant FAST AND LS TTL DATA 5-379

SN54/74LS682 • SN54/74LS684 • SN54/74LS688 GUARANTEED OPERATING RANGES Symbol Parameter Min Typ Max Unit VCC Supply Voltage 54 4.5 5.0 5.5 V 74 4.75 5.0 5.25 TA Operating Ambient Temperature Range 54 – 55 25 125 °C 74 0 25 70 IOH Output Current — High 54, 74 –0.4 mA IOL Output Current — Low 54 12 mA 74 24 DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified) Limits Symbol Parameter Min Typ Max Unit Test Conditions VIH Input HIGH Voltage 2.0 Guaranteed Input HIGH Voltage for V All Inputs VIL Input LOW Voltage 54 0.7 Guaranteed Input LOW Voltage for 74 0.8 V All Inputs VIK Input Clamp Diode Voltage 54 – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA VOH Output HIGH Voltage 74 2.5 3.5 2.7 3.5 V VCC = MIN, IOH = MAX, VIN = VIH V or VIL per Truth Table VOL Output LOW Voltage 54, 74 0.25 0.4 V IOL = 12 mA VCC = VCC MIN, 74 0.35 0.5 V IOL = 24 mA VIN = VIL or VIH per Truth Table IIH Input HIGH Current LS628-Q Inputs 20 µA VCC = MAX, VIN = 2.7 V 0.1 Others 0.1 mA VCC = MAX, VIN = 5.5 V – 0.4 LS682-Q Inputs – 0.2 mA VCC = MAX, VIN = 7.0 V IIL Input LOW Current mA Others VCC = MAX, VIN = 0.4 V mA IOS Short Circuit Current (Note 1) – 30 – 130 mA VCC = MAX mA LS682 70 65 mA VCC = MAX Power Supply LS684 65 mA ICC Current LS688 Note 1: Not more than one output should be shorted at a time, nor for more than 1 second. FAST AND LS TTL DATA 5-380

SN54/74LS682 • SN54/74LS684 • SN54/74LS688 LOGIC DIAGRAMS P7 (17) P7 (17) Q7 (18) (18) (15) P6 (15) Q7 (16) Q6 (16) P6 (13) (13) Q6 (14) P5 (14) P5 (11) Q5 Q5 (12) P4 (11) (8) Q4 (12) (9) (8) (19) (6) P3 (9) P=Q (7) Q3 (4) (5) P2 (6) (2) Q2 (7) (3) P1 (4) P4 Q1 (5) Q4 P3 P0 (2) (19) Q0 (3) P=Q Q3 P2 Q2 P1 (1) Q1 P>Q P0 Q0 SN54 / 74LS682 thru LS684 G (1) SN54 / 74LS688 FAST AND LS TTL DATA 5-381

SN54/74LS682•SN54/74LS684•SN54/74LS688 AC CHARACTERISTICS (TA = 25°C) SN54/74LS682 Symbol Parameter Limits Unit Test Conditions ns tPLH Propagation Delay, P to P = Q Min Typ Max ns VCC = 5.0 V tPHL ns CL = 45 pF 13 25 ns RL = 667 Ω tPLH Propagation Delay, Q to P = Q 15 25 tPHL Test Conditions 14 25 tPLH Propagation Delay, P to P > Q 15 25 VCC = 5.0 V tPHL CL = 45 pF 20 30 RL = 667 Ω tPLH Propagation Delay, Q to P > Q 15 30 tPHL Test Conditions 21 30 19 30 VCC = 5.0 V CL = 45 pF SN54/74LS684 RL = 667 Ω Symbol Parameter Limits Unit ns tPLH Propagation Delay, P to P = Q Min Typ Max ns tPHL ns 15 25 ns tPLH Propagation Delay, Q to P = Q 17 25 tPHL 16 25 tPLH Propagation Delay, P to P > Q 15 25 tPHL 22 30 tPLH Propagation Delay, Q to P > Q 17 30 tPHL 24 30 20 30 SN54/74LS688 Symbol Parameter Limits Unit Propagation Delay, P to P = Q ns tPLH Propagation Delay, Q to P = Q Min Typ Max ns tPHL Propagation Delay, G , G1 to P = Q ns 12 18 tPLH 17 23 tPHL 12 18 tPLH 17 23 tPHL 12 18 13 20 FAST AND LS TTL DATA 5-382

TRI-STATE OCTAL BUFFERS SN54/74LS795 SN54/74LS796 The SN54 / 74LS795 thru SN54 / 74LS798 device types provide a second SN54/74LS797 source for the 71 / 81LS95 thru 71 / 81LS98 series. These devices are octal SN54/74LS798 low power Schottky versions of the 70/8095 thru 70/8098 3-STATE Hex Buffers. The LS795 and LS797 are noninverting and the LS796 and LS798 TRI-STATE OCTAL BUFFERS are inverting functions. On each buffer, one of the two inputs is used as a LOW POWER SCHOTTKY control line to gate the output into the high impedance state, while the other input passes the data through the buffer. On the LS795 and LS796 access is through a 2-input NOR gate, with all eight 3-STATE enable lines common. On the LS797 and LS798, four buffers are enabled from one common line and the other four buffers from another common line. On all device types the 3-STATE condition is achieved by applying a high logic level to the enable pins. TRUTH TABLES J SUFFIX CERAMIC LS795 LS796 CASE 732-03 INPUTS OUTPUT INPUTS OUTPUT 20 N SUFFIX 1 PLASTIC G1 G2 A Y G1 G2 A Y CASE 738-03 20 HXX Z HXX Z 1 DW SUFFIX XHX Z XHX Z SOIC L LH H L LH L 20 LLL L LLL H 1 CASE 751D-03 LS797 LS798 INPUTS OUTPUT INPUTS OUTPUT GA Y GA Y HX Z HX Z ORDERING INFORMATION LH H LH L LL L LL H SN54LSXXXJ Ceramic SN74LSXXXN Plastic SN74LSXXXDW SOIC GUARANTEED OPERATING RANGES Symbol Parameter Min Typ Max Unit VCC Supply Voltage 54 4.5 5.0 5.5 V 74 4.75 5.0 5.25 TA Operating Ambient Temperature Range 54 – 55 25 125 °C 74 0 25 70 IOH Output Current — High 54 – 2.6 mA 74 – 5.0 IOL Output Current — Low 54 8.0 mA 74 16 FAST AND LS TTL DATA 5-383

SN54/74LS795 • SN54/74LS796 SN54/74LS797 • SN54/74LS798 LOGIC DIAGRAMS VCC G2 A8 Y8 A7 Y7 A6 Y6 A5 Y5 VCC G2 A8 Y8 A7 Y7 A6 Y6 A5 Y5 20 19 18 17 16 15 14 13 12 11 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 G1 A1 Y1 A2 Y2 A3 Y3 A4 Y4 GND G1 A1 Y1 A2 Y2 A3 Y3 A4 Y4 GND SN54/74LS795 SN54/74LS796 VCC G2 A8 Y8 A7 Y7 A6 Y6 A5 Y5 VCC G2 A8 Y8 A7 Y7 A6 Y6 A5 Y5 20 19 18 17 16 15 14 13 12 11 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 G1 A1 Y1 A2 Y2 A3 Y3 A4 Y4 GND G1 A1 Y1 A2 Y2 A3 Y3 A4 Y4 GND SN54/74LS797 SN54/74LS798 FAST AND LS TTL DATA 5-384

SN54/74LS795 THRU SN54/74LS798 DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified) Limits Symbol Parameter Min Typ Max Unit Test Conditions VIH Input HIGH Voltage 2.0 V Guaranteed Input HIGH Voltage for All Inputs VIL Input LOW Voltage 54 0.7 Guaranteed Input LOW Voltage for 74 0.8 V All Inputs VIK Input Clamp Diode Voltage – 0.65 – 1.5 V VCC = MIN, IIN = – 18 mA VOH Output HIGH Voltage 54 2.5 3.5 V 74 2.7 3.5 VCC = MIN, IOH = MAX V VOL Output LOW Voltage 54, 74 0.25 0.4 V IOL = 8.0 mA VCC = VCC MIN, 74 0.35 0.5 V IOL = 16 mA VIN = VIL or VIH per Truth Table IOZH Output Off Current — HIGH 20 µA VCC = MAX, VOUT = 2.7 V IOZL Output Off Current — LOW – 20 µA VCC = MAX, VOUT = 0.4 V IIH 20 µA VCC = MAX, VIN = 2.7 V Input HIGH Current – 0.1 mA VCC = MAX, VIN = 7.0 V IIL Input LOW Current – 0.4 mA VCC = MAX, VIN = 0.4 V A Input, Both G at 0.4 V – 0.4 G Input A Input, Both G at 2.0 V – 20 µA VCC = MAX, VIN = 0.5 V IOS Short Circuit Current (Note 1) – 30 –130 mA VCC = MAX Power Supply LS795/LS797 26 mA 21 VCC = MAX ICC Current LS795/LS798 mA Note 1: Not more than one output should be shorted at a time, nor for more than 1 second. AC CHARACTERISTICS (TA = 25°C) Limits Symbol Parameter LS795 / LS797 LS796 / LS798 Unit Test Conditions Propagation Delay ns tPLH Output Enable Time Min Typ Max Min Typ Max ns VCC = 5.0 V tPHL Output Disable Time ns CL = 15 pF 11 16 6.0 10 tPZH 15 22 13 17 CL = 5.0 pF tPZL 16 25 17 27 tPHZ 13 20 16 25 tPLZ 13 20 13 20 19 27 18 27 FAST AND LS TTL DATA 5-385

For:colleen Printed on:Tue, Jun 23, 1998 17:15:53 From book:DL121CH6 (5) VIEW Document:CH6TAB121 VIEW Last saved on:Tue, Jun 23, 1998 15:27:13 Document:BTR121 VIEW Last saved on:Tue, Jun 23, 1998 15:27:16

FAST AND LS TTL Reliability Data 6

The “BETTER” program is offered on logic only, in dual-in-line ceramic and plastic packages. Better Processing — HOW TO ORDER Standard Product Plus: MC10101 P D LEVEL II (Suffix D) Part Standard BETTER • 100% burn-in to MIL-STD-883 test conditions — 160 hours Identification Package PROCESSING at +125°C or 1.0 eV Arrhenius time/temperature equiva- LEVEL II = SUFFIX D lent. Suffix • 100% post burn-in functional and dc parametric tests at Part Marking 25°C (or max rated TA at Motorola’s option). Maximum PDA of 2% (functional) and 5% (DC and functional). The Standard Motorola part number with the corresponding “BETTER” suffix can be ordered from your local authorized Motorola distributor or Motorola sales offices. “BETTER” pricing will be quoted as an adder to standard commercial product price. “RAP” Reliability Audit Program for Logic Integrated Circuits 1.0 INTRODUCTION Handbook” which contains data for all Motorola Semiconduc- tors (#BR518S). The Reliability Audit Program developed in March 1977 is the Motorola internal reliability audit which is designed to RAP is a system of environmental and electrical tests assess outgoing product performance under accelerated performed periodically on randomly selected samples of stress conditions. Logic Reliability Engineering has overall standard products. Each sample receives the tests specified responsibility for RAP, including updating its requirements, in section 2.0. Frequency of testing is specified per internal interpreting its results, administration at offshore locations, document 12MRM15301A. and monthly reporting of results. These reports are available at all sales offices. Also available is the “Reliability and Quality FAST AND LS TTL DATA 6-2

2.0 RAP TEST FLOW Pull 500* piece sample from lot following Group A acceptance. 45* 340 100 Initial Op Life Seal** 40 hours PTHB PTH*** Temp Cycle interim 48 hrs 48 hrs 40 cycles electrical Interim interim Op Life Electrical test 210 hrs (Additional) PTH Add 460 cycles Final 48 hrs Interim# (Additional) interim Electrical test Op Life# Add 500 cycles 750 hrs final (Additional) interim* Final# test Electrical (1000 hrs) Final Final Temp Cycle# Electrical Electrical 1000 cycles scrap (48 hrs) (96 hrs) (Additional) Final Electrical & Seal** (2000 cycles) scrap scrap # One sample per month for FAST, LS, 10H, 10K, MG CMOS, and HSL CMOS. * PTHB or PTH not required for hermetic products: reduce total sample size to 450 pcs. Additional sample reductions for high pin-count devices per TABLE II notes. ** Seal (Fine & Gross Leak) required for hermetic products. *** PTH to be used when sockets for PTHB are not available. 3.0 TEST CONDITIONS AND COMMENTS NOTES: 1. All standard 25°C dc and functional parameters will be PTHB — 15 psig/121°C/100% RH at rated VCC or VEE — PTHB — to be performed on plastic encapsulated devices measured Go/No/Go at each readout. PTHB — only. 2. Any indicated failure is first verified and then submitted to TEMP CYCLING — MIL-STD-883, Method 1010, Condition the Product Analysis Lab for detailed analysis. TEMP CYCLING — C, – 65°C/+150°C. 3. Sampling to include all package types routinely. 4. Device types sampled will be by generic type within each OP LIFE — MIL-STD-883, Method 1005, Condition C OP LIFE — (Power plus Reverse Bias), TA = 145°C. logic I/C product family (MECL, TTL, etc.) and will include all assembly locations (Korea, Philippines, Malaysia, etc.) 5. 16 hrs. PTHB is equivalent to approximately 800 hours of 85°C/85% RH THB for VCC ≤ 15 V. 6. Only moisture related failures (like corrosion) are criteria for failure on PTHB test. 7. Special device specifications (48A’s) for logic products will reference 12MRM15301A as source of generic data for any customer required monthly audit reports. FAST AND LS TTL DATA 6-3

FAST AND LS TTL DATA 6-4

FAST AND LS TTL Package Information 7 Including Surface Mount

BIPOLAR LOGIC SURFACE MOUNT WHY SURFACE MOUNT? Automatic placement equipment is available that can place Surface Mount components at the rate of a few thousand per Surface Mount Technology is now being utilized to offer an- hour to hundreds of thousands of components per hour. swers to many problems that have been created in the use of insertion technology. Surface Mount Technology is cost effective, allowing the manufacturer the opportunity to produce smaller units and/or Limitations have been reached with insertion packages and offer increased functions with the same size product. PC board technology. Surface Mount Technology offers the opportunity to continue to advance the State-of-the-Art de- SURFACE MOUNT AVAILABILITY signs that cannot be accomplished with Insertion Technology. Bipolar Logic is currently offering LS-TTL and FAST-TTL in Surface Mount Packages allow more optimum device per- production quantities in SOIC packages. formance with the smaller Surface Mount configuration. Inter- nal lead lengths, parasitic capacitance and inductance that Refer to the following Selector Guide (SG366/D) which indi- placed limitations on chip performance have been reduced. cate availability and package type for these families. The lower profile of Surface Mount Packages allows more These families may be ordered in rails or on Tape and Reel. boards to be utilized in a given amount of space. They are Refer to Tape and Reel information for ordering details. stacked closer together and utilize less total volume than in- sertion populated PC boards. THERMAL DATA Printed circuit costs are lowered with the reduction of the The power dissipation of surface mount packages is depen- number of board layers required. The elimination or reduction dent on many factors that must be taken into consideration in of the number of plated through holes in the board, contribute the initial board design. The board material, the board surface significantly to lower PC board prices. metal thickness, pad area and the proximity to other heat gen- erating components all have a bearing on the device dissipa- Surface Mount assembly does not require the preparation tion capability. of components that are common on insertion technology lines. Surface Mount components are sent directly to the assembly line, eliminating an intermediate step. 200 180 160 MIN DIE SIZE °C/W 2K MILS2 θJA 140 120 SEE FIG. 2 FOR MAX DIE SIZE 8K MILS2 100 SO-8 HEAT SINK DETAIL (.090″ x .110″) LEADFRAME SO-14 SO-16 (.090″ x .170″) METAL = COPPER (.090″ x .170″) NARROW PACKAGE STYLE DATA TAKEN USING PHILIPS SO TEST BOARD # 7322-078, 80873 Figure 2-1. Thermal Resistance, Junction-To-Ambient (°C/W) Measurement specimens are solder mounted on printed cir- This data was collected using thermal test die in 20-pin PLCC cuit card 19 mm × 28 mm × 1.5 mm in still air. No auxiliary ther- packages on PLCC test boards (2.24″ x 2.24″ x .062″ glass mal condition aids are used. epoxy, type FR-4, with solder coated 1 oz./sq. ft. copper). FAST AND LS TTL DATA 7-2

TAPE AND REEL STANDARD BIPOLAR LOGIC INTEGRATED CIRCUITS RS-481A specification. The antistatic embossed tape pro- vides a secure cavity sealed with a peel-back cover tape. Motorola has now added the convenience of Tape and Reel packaging for our growing family of standard Integrated Circuit products. The packaging fully conforms to the latest EIA SOIC DEVICES MECHANICAL POLARIZATION Typical View is from tape side Linear direction of travel GENERAL INFORMATION — Reel Size 13 inch (330 mm) Suffix R2 — Tape Width 12 mm to 24 mm (see table) — Units/Reel (see table) — No Partial Reel Counts Available and Minimum Lot Size is Per Table ORDERING INFORMATION To order devices which are to be delivered in Tape and Reel, add the suffix R2 to the device number being ordered. TABLE 2.1 Tape and Reel Data Device Type Tape Width Device/Reel Reel Size Min Lot Size Per Part No. (mm) (inch) Tape and Reel 2,500 SO-8 12 2,500 13 5,000 SO-14 16 2,500 13 5,000 SO-16 16 1,000 13 5,000 SO-16 Wide 16 1,000 13 5,000 SO-20 Wide 24 13 5,000 FAST AND LS TTL DATA 7-3

PACKAGE OUTLINES NOTES: 1. DIMENSIONS “A” AND “B” ARE DATUMS AND SOIC “T” IS A DATUM SURFACE. 2. DIMENSIONING AND TOLERANCING PER ANSI Case 751A-02 D Suffix Y14.5M, 1982. 14-Pin Plastic 3. CONTROLLING DIMENSION: MILLIMETER. SO-14 4. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. -A- 5. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 14 8 6. 751A-01 IS OBSOLETE, NEW STANDARD 751A-02. -B- P 0.25 (0.010) M B M MILLIMETERS INCHES 1 7 PL 7 DIM MIN MAX MIN MAX G C R X 45° A 8.55 8.75 0.337 0.344 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 SEATING F 0.40 1.25 0.016 0.049 K PLANE G 1.27 BSC 0.050 BSC D14 PL M F J J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 0.25 (0.010) M T B S A S M 0° 7° 0° 7° P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 Case 751B-03 D Suffix NOTES: 16-Pin Plastic 1. DIMENSIONING AND TOLERANCING PER ANSI SO-16 Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. -A- 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 16 9 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. -B- P 0.25 (0.010) M B M 5. 751B-01 IS OBSOLETE, NEW STANDARD 751B-03. 1 8 PL MILLIMETERS INCHES 8 DIM MIN MAX MIN MAX A 9.80 10.00 0.386 0.393 R X 45° B 3.80 4.00 0.150 0.157 MF C 1.35 1.75 0.054 0.068 G C D 0.35 0.49 0.014 0.019 -T- SEATING F 0.40 1.25 0.016 0.049 D16 PL PLANE 0.25 (0.010) M T B S A S G 1.27 BSC 0.050 BSC K J 0.19 0.25 0.008 0.009 J K 0.10 0.25 0.004 0.009 M 0° 7° 0° 7° P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 Case 751D-03 DW Suffix NOTES: 20-Pin Plastic 1. DIMENSIONING AND TOLERANCING PER ANSI SO-20 (WIDE) Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. -A- 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 20 11 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. -B- P 0.25 (0.010) M B M 5. 751D-01, AND -02 OBSOLETE, NEW STANDARD 751D-03. 1 10 10 PL MILLIMETERS INCHES DIM MIN MAX MIN MAX A 12.65 12.95 0.499 0.510 G B 7.40 7.60 0.292 0.299 R X 45° C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 F 0.50 0.90 0.020 0.035 -T- C SEATING G 1.27 BSC 0.050 BSC PLANE J 0.25 0.32 0.010 0.012 MF J K 0.10 0.25 0.004 0.009 K M 0° 7° 0° 7° AS D 20 PL P 10.05 10.55 0.395 0.415 0.25 (0.010) M T B S R 0.25 0.75 0.010 0.029 FAST AND LS TTL DATA 7-4

PACKAGE OUTLINES NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI SOIC (continued) Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. Case 751E-03 DW Suffix 3. DIMENSION A AND B DO NOT INCLUDE MOLD 24-Pin Plastic PROTRUSION. SO-24 (WIDE) 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. -A- 5. 751E-01 AND -02 OBSOLETE, NEW STANDARD 751E-03. 24 13 -B- P 0.25 (0.010) M B M 1 12 12 PL MILLIMETERS INCHES G DIM MIN MAX MIN MAX A 15.25 15.54 0.601 0.612 B 7.40 7.60 0.292 0.299 R X 45° C 2.35 2.65 0.093 0.104 D 0.35 0.49 0.014 0.019 -T- C SEATING F 0.41 0.90 0.016 0.035 D 24 PL PLANE G 1.27 BSC 0.050 BSC K MF J J 0.229 0.317 0.0090 0.0125 K 0.127 0.292 0.0050 0.0115 M 0° 8° 0° 8° P 10.05 10.55 0.395 0.415 0.25 (0.010) M T B S A S R 0.25 0.75 0.010 0.029 FAST AND LS TTL DATA 7-5

PACKAGE OUTLINES CERAMIC DUAL IN-LINE Case 632-08 J Suffix 14-Pin Ceramic Dual In-Line -A- 8 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI 14 -B- Y14.5M, 1982. 1 2. CONTROLLING DIMENSION: INCH. 7 3. DIMENSION L TO CENTER OF LEAD WHEN L FORMED PARALLEL. C 4. DIM F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5. 632-01 THRU -07 OBSOLETE, NEW STANDARD 632-08. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 19.05 19.94 0.750 0.785 B 6.23 7.11 0.245 0.280 -T- C 3.94 5.08 0.155 0.200 SEATING K D 0.39 0.50 0.015 0.020 PLANE F 1.40 1.65 0.055 0.065 F G 2.54 BSC 0.100 BSC GN M J 0.21 0.38 0.008 0.015 D 14 PL J 14 PL 0.25 (0.010) M T A S 0.25 (0.010) M T B S K 3.18 4.31 0.125 0.170 L 7.62 BSC 0.300 BSC M 0° 15° 0° 15° N 0.51 1.01 0.020 0.040 -A- 9 Case 620-09 J Suffix NOTES: 16-Pin Ceramic Dual In-Line 1. DIMENSIONING AND TOLERANCING PER ANSI 16 -B- Y14.5M, 1982. L 2. CONTROLLING DIMENSION: INCH. 1 8 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. C 4. DIM F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. 5. 620-01 THRU -08 OBSOLETE, NEW STANDARD 620-09. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 19.05 19.55 0.750 0.770 -T- B 6.10 7.36 0.240 0.290 SEATING K C — 4.19 — 0.165 PLANE D 0.39 0.53 0.015 0.021 F E 1.27 BSC 0.050 BSC M F 1.40 1.77 0.055 0.070 J 16 PL EN 0.25 (0.010) M T B S G 2.54 BSC 0.100 BSC G J 0.23 0.27 0.009 0.011 D 16 PL K — 5.08 — 0.200 0.25 (0.010) M T A S L 7.62 BSC 0.300 BSC M 0° 15° 0° 15° N 0.39 0.88 0.015 0.035 Case 732-03 J Suffix 20-Pin Ceramic Dual In-Line 20 11 NOTES: 1 10 1. LEADS WITHIN 0.25 mm (0.010) DIA., TRUE POSITION AT SEATING PLANE, AT MAXIMUM A B MATERIAL CONDITION. F 2. DIM L TO CENTER OF LEADS WHEN FORMED C PARALLEL. 3. DIM A AND B INCLUDES MENISCUS. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 23.88 25.15 0.940 0.990 L B 6.60 7.49 0.260 0.295 C 3.81 5.08 0.150 0.200 D 0.38 0.56 0.015 0.022 F 1.40 1.65 0.055 0.065 G 2.54 BSC 0.100 BSC N J H 0.51 1.27 0.020 0.050 GK M J 0.20 0.30 0.008 0.012 H SEATING K 3.18 4.06 0.125 0.160 D PLANE L 7.62 BSC 0.300 BSC M 0° 15° 0° 15° N 0.25 1.02 0.010 0.040 FAST AND LS TTL DATA 7-6

PACKAGE OUTLINES NOTES: 1. DIMENSION L TO CENTER OF LEADS WHEN CERAMIC DUAL IN-LINE (continued) FORMED PARALLEL. 2. DIMENSIONING AND TOLERANCING PER ANSI Case 758-01 J Suffix Y14.5, 1973. 24-Pin Ceramic Dual In-Line 24 13 B 1 12 MILLIMETERS INCHES DIM MIN MAX MIN MAX A 31.50 32.64 1.240 1.285 -A- B 7.24 7.75 0.285 0.305 F L C 3.68 4.44 0.145 0.175 C D 0.38 0.53 0.015 0.021 F 1.14 1.57 0.045 0.062 G 2.54 BSC 0.100 BSC J 0.20 0.33 0.008 0.013 -T- N KJ K 2.54 4.19 0.100 0.165 P SEATING L 7.62 7.87 0.300 0.310 PLANE INSIDE OF LEADS N 0.51 1.27 0.020 0.050 G P 9.14 10.16 0.360 0.400 D 20 PL 0.25 (0.010) M T A M 24 Case 623-05 J Suffix NOTES: 24-Pin Ceramic Dual In-Line 1. DIM “L” TO CENTER OF LEADS WHEN 1 FORMED PARALLEL. (WIDE BODY) 2. LEADS WITHIN 0.13 mm (0.005) RADIUS OF A TRUE POSITION AT SEATING PLANE AT F 13 MAXIMUM MATERIAL CONDITION. (WHEN FORMED PARALLEL). D B G MILLIMETERS INCHES 12 DIM MIN MAX MIN MAX SEATING PLANE A 31.24 32.77 1.230 1.290 C B 12.70 15.49 0.500 0.610 C 4.06 5.59 0.160 0.220 D 0.41 0.51 0.016 0.020 F 1.27 1.52 0.050 0.060 G 2.54 BSC 0.100 BSC L J 0.20 0.30 0.008 0.012 MJ K 3.18 4.06 0.125 0.160 N L 15.24 BSC 0.600 BSC K M 0° 15° 0° 15° N 0.51 1.27 0.020 0.050 Case 740-03 J Suffix 48-Pin Ceramic Dual In-Line -A- 25 NOTES: 1. DIMENSIONING AND TOLERANCING PER 48 -B- ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 1 24 3. DIM L TO CENTER OF LEAD WHEN FORMED PARALLEL. N C MILLIMETERS INCHES K DIM MIN MAX MIN MAX A 60.36 61.56 2.376 2.424 L B 14.64 15.34 0.576 0.604 M C 3.05 4.31 0.120 0.170 J 0.25 (0.010) M T B M D 0.381 0.533 0.015 0.021 E 1.27 BSC 0.050 BSC -T- F 0.762 1.397 0.030 0.055 SEATING G 2.54 BSC 0.100 BSC PLANE E J 0.204 0.330 0.008 0.013 FG D 48 PL K 2.54 4.19 0.100 0.165 0.25 (0.010) M T A M L 15.24 BSC 0.600 BSC M 0° 10° 0° 10° N 1.016 1.524 0.040 0.060 FAST AND LS TTL DATA 7-7

PACKAGE OUTLINES PLASTIC Case 646-06 N Suffix 14-Pin Plastic 14 8 NOTES: 1 1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE B POSITION AT SEATING PLANE AT MAXIMUM A MATERIAL CONDITION. F 7 2. DIMENSION “L” TO CENTER OF LEADS WHEN FORMED PARALLEL. HG 3. DIMENSION “B” DOES NOT INCLUDE MOLD FLASH. 4. ROUNDED CORNERS OPTIONAL. 5. 646-05 OBSOLETE, NEW STANDARD 646-06. NOTE 4 MILLIMETERS INCHES L DIM MIN MAX MIN MAX A 18.16 19.56 0.715 0.770 B 6.10 6.60 0.240 0.260 C 3.69 4.69 0.145 0.185 C D 0.38 0.53 0.015 0.021 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC N J H 1.32 2.41 0.052 0.095 M SEATING J 0.20 0.38 0.008 0.015 D PLANE K K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC M 0° 10° 0° 10° N 0.39 1.01 0.015 0.039 Case 648-08 N Suffix NOTES: 16-Pin Plastic 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. -A- 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION “L” TO CENTER OF LEADS WHEN 16 9 FORMED PARALLEL. 4. DIMENSION “B” DOES NOT INCLUDE MOLD B FLASH. 5. ROUNDED CORNERS OPTIONAL. 18 6. 648-01 THRU -07 OBSOLETE, NEW STANDARD 648-08. F MILLIMETERS INCHES C L DIM MIN MAX MIN MAX S A 18.80 19.55 0.740 0.770 B 6.35 6.85 0.250 0.270 -T- SEATING C 3.69 4.44 0.145 0.175 PLANE D 0.39 0.53 0.015 0.021 F 1.02 1.77 0.040 0.070 M G 2.54 BSC 0.100 BSC H K J H 1.27 BSC 0.050 BSC G J 0.21 0.38 0.008 0.015 D 16 PL K 2.80 3.30 0.110 0.130 L 7.50 7.74 0.295 0.305 0.25 (0.010) M T A M M 0° 10° 0° 10° S 0.51 1.01 0.020 0.040 -A- Case 738-03 N Suffix NOTES: 20-Pin Plastic 1. DIMENSIONING AND TOLERANCING PER ANSI 20 11 Y14.5M, 1982. L 2. CONTROLLING DIMENSION: INCH. B 3. DIMENSION “L” TO CENTER OF LEAD WHEN M FORMED PARALLEL. 1 10 J 20 PL 4. DIMENSION “B” DOES NOT INCLUDE MOLD 0.25 (0.010) M T B M FLASH. C 5. 738-02 OBSOLETE, NEW STANDARD 738-03. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 25.66 27.17 1.010 1.070 -T- K B 6.10 6.60 0.240 0.260 N SEATING C 3.81 4.57 0.150 0.180 PLANE D 20 PL E 0.25 (0.010) M T A M D 0.39 0.55 0.015 0.022 GF E 1.27 BSC 0.050 BSC F 1.27 1.77 0.050 0.070 G 2.54 BSC 0.100 BSC J 0.21 0.38 0.008 0.015 K 2.80 3.55 0.110 0.140 L 7.62 BSC 0.300 BSC M 0° 15° 0° 15° N 0.51 1.01 0.020 0.040 FAST AND LS TTL DATA 7-8

PACKAGE OUTLINES PLASTIC (continued) Case 724-03 N Suffix 24-Pin Plastic 24 -A- 13 NOTES: 1 1. CHAMFERRED CONTOUR OPTIONAL. E -B- 2. DIM “L” TO CENTER OF LEADS WHEN FORMED F PARALLEL. 12 3. DIMENSIONS AND TOLERANCES PER ANSI Y14.5M, 1982. C 4. CONTROLLING DIMENSION: INCH. MILLIMETERS INCHES L DIM MIN MAX MIN MAX A 31.25 32.13 1.230 1.265 B 6.35 6.85 0.250 0.270 C 3.69 4.44 0.145 0.175 -T- K NOTE 1 D 0.38 0.51 0.015 0.020 N SEATING M E 1.27 BSC 0.050 BSC PLANE D 24 PL J 24 PL 0.25 (0.010) M T F 1.02 1.52 0.040 0.060 0.25 (0.010) M T AM G 2.54 BSC 0.100 BSC G J 0.18 0.30 0.007 0.012 K 2.80 3.55 0.110 0.140 BM L 7.62 BSC 0.300 BSC M 0° 15° 0° 15° N 0.51 1.01 0.020 0.040 P 24 Case 649-03 N Suffix NOTES: Q 24-Pin Plastic 1. LEADS WITHIN 0.13 mm (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM A Wide Body MATERIAL CONDITION. 2. DIMENSION “L” TO CENTER OF LEADS WHEN 13 FORMED PARALLEL. 3. 649-02 OBSOLETE, NEW STD 649-03 SEE ISSUE B “C” FOR REFERENCE. 12 MILLIMETERS INCHES DIM MIN MAX MIN MAX 1 A 31.50 32.13 1.240 1.265 H B 13.21 13.72 0.520 0.540 N C 4.70 5.21 0.185 0.205 D 0.38 0.51 0.015 0.020 FC F 1.02 1.52 0.040 0.060 L G 2.54 BSC 0.100 BSC H 1.65 2.16 0.065 0.085 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 K L 14.99 15.49 0.590 0.610 JM M — 10° — 10° Case 711-03 N Suffix D 40-Pin Plastic N 0.51 1.02 0.020 0.040 G SEATING P 0.13 0.38 0.005 0.015 PLANE Q 0.51 0.76 0.020 0.030 40 21 NOTES: 1 1. POSITIONAL TOLERANCE OF LEADS (D), SHALL B BE WITHIN 0.25 mm (0.010) AT MAXIMUM H MATERIAL CONDITION, IN RELATION TO SEATING 20 PLANE AND EACH OTHER. 2. DIMENSION L TO CENTER OF LEADS WHEN C FORMED PARALLEL. N 3. DIMENSION B DOES NOT INCLUDE MOLD FLASH. DK MILLIMETERS INCHES SEATING DIM MIN MAX MIN MAX PLANE A 51.69 52.45 2.035 2.065 A L B 13.72 14.22 0.540 0.560 GF J C 3.94 5.08 0.155 0.200 M D 0.36 0.56 0.014 0.022 F 1.02 1.52 0.040 0.060 G 2.54 BSC 0.100 BSC H 1.65 2.16 0.065 0.085 J 0.20 0.38 0.008 0.015 K 2.92 3.43 0.115 0.135 L 15.24 BSC 0.600 BSC M 0° 15° 0° 15° N 0.51 1.02 0.020 0.040 FAST AND LS TTL DATA 7-9

PACKAGE OUTLINES PLASTIC (continued) Case 767-02 N Suffix 48-Pin Plastic -A- NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI 48 25 TIP TAPER Y14.5M, 1982. DETAIL X 2. CONTROLLING DIMENSION: INCH. 1 -B- 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. -T- 24 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010). SEATING 5. 767-01 OBSOLETE. NEW STANDARD 767-02. PLANE MILLIMETERS INCHES DIM MIN MAX MIN MAX A 61.34 62.10 2.415 2.445 L B 13.72 14.22 0.540 0.560 C C 3.94 5.08 0.155 0.200 D 0.36 0.55 0.014 0.022 F 1.02 1.52 0.040 0.060 G 2.54 BSC 0.100 BSC H 1.79 BSC 0.070 BSC M J 0.20 0.38 0.008 0.015 DETAIL X N 48 PL K 2.92 3.81 0.115 0.150 J 48 PL FG 0.25 (0.010) M T B S L 15.24 BSC 0.600 BSC D M 0° 0° 0° 0° 0.51 (0.020) M T A S N 0.51 1.01 0.020 0.040 FAST AND LS TTL DATA 7-10

PACKAGE OUTLINES PLCC Case 775-02 FN Suffix 20-Pin Plastic -L- -N- Y BRK B 0.18 (0.007) M T N S –P S L S –M S D U 0.18 (0.007) M T N S –P S L S –M S 20 -M- Z1 -P- 1 W D V X G1 VIEW D-D 0.25 (0.010) M T N S –P S L S –M S A 0.18 (0.007) M T L S –M S N S –P S H 0.18 (0.007) M T L S –M S N S –P S 0.18 (0.007) M T N S –P S L S –M S Z F R 0.18 (0.007) M T L S –M S N S –P S DETAIL S 0.18 (0.007) M T L S –M S N S –P S 0.18 (0.007) M T N S –P S L S –M S C K1 E K 0.10 (0.004) G J -T- SEATING G1 PLANE 0.25 (0.010) S T L S –M S DETAIL S N S –P S MILLIMETERS INCHES DIM MIN MAX MIN MAX A 9.78 10.03 0.385 0.395 B 9.78 10.03 0.385 0.395 C 4.20 4.57 0.165 0.180 E 2.29 2.79 0.090 0.110 F 0.33 0.48 0.013 0.019 G 1.27 BSC 0.050 BSC H 0.66 0.81 0.026 0.032 J 0.51 — 0.020 — NOTES: 1. DATUMS -L-, -M-, -N-, AND -P- DETERMINED K 0.64 — 0.025 — WHERE TOP OF LEAD SHOULDER EXIT PLASTIC BODY AT MOLD PARTING LINE. R 8.89 9.04 0.350 0.356 2. DIM GI, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. U 8.89 9.04 0.350 0.356 3. DIM R AND U DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION V 1.07 1.21 0.042 0.048 IS 0.25 (0.010) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI W 1.07 1.21 0.042 0.048 Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. X 1.07 1.42 0.042 0.056 6. 775-01 IS OBSOLETE, NEW STANDARD 775-02. Y — 0.50 — 0.020 Z 2° 10° 2° 10° G1 7.88 8.38 0.310 0.330 K1 1.02 — 0.040 — Z1 2° 10° 2° 10° FAST AND LS TTL DATA 7-11

PACKAGE OUTLINES PLCC (continued) Case 776-02 FN Suffix 28-Pin Plastic -N- Y BRK D B 0.18 (0.007) M T N S –P S L S –M S -M- U 0.18 (0.007) M T N S –P S L S –M S -L- 28 LEADS W Z1 ACTUAL 28 1 D -P- V G1 0.25 (0.010) M T N S –P S L S –M S X VIEW D-D A 0.18 (0.007) M T L S –M S N S –P S H 0.18 (0.007) M T L S –M S N S –P S 0.18 (0.007) M T N S –P S L S –M S Z R 0.18 (0.007) M T L S –M S N S –P S C K1 E 0.10 (0.004) K G J -T- SEATING F 0.18 (0.007) M T L S –M S N S –P S DETAIL S 0.18 (0.007) M T N S –P S L S –M S PLANE DETAIL S G1 0.25 (0.010) S T L S –M S N S –P S MILLIMETERS INCHES DIM MIN MAX MIN MAX A 12.32 12.57 0.485 0.495 B 12.32 12.57 0.485 0.495 C 4.20 4.57 0.165 0.180 E 2.29 2.79 0.090 0.110 F 0.33 0.48 0.013 0.019 NOTES: 1. DUE TO SPACE LIMITATION, CASE 776-02 SHALL G 1.27 BSC 0.050 BSC BE REPRESENTED BY A GENERAL (SMALLER) CASE OUTLINE DRAWING RATHER THAN H 0.66 0.81 0.026 0.032 SHOWING ALL 28 LEADS. 2. DATUMS -L-, -M-, -N-, AND -P- DETERMINED J 0.51 — 0.020 — WHERE TOP OF LEAD SHOULDER EXIT PLASTIC BODY AT MOLD PARTING LINE. K 0.64 — 0.025 — 3. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. R 11.43 11.58 0.450 0.456 4. DIM R AND U DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTRUSION U 11.43 11.58 0.450 0.456 IS 0.25 (0.010) PER SIDE. 5. DIMENSIONING AND TOLERANCING PER ANSI V 1.07 1.21 0.042 0.048 Y14.5M, 1982. 6. CONTROLLING DIMENSION: INCH. W 1.07 1.21 0.042 0.048 7. 776-01 IS OBSOLETE, NEW STANDARD 776-02. X 1.07 1.42 0.042 0.056 Y — 0.50 — 0.020 Z 2° 10° 2° 10° G1 10.42 10.92 0.410 0.430 K1 1.02 — 0.040 — Z1 2° 10° 2° 10° FAST AND LS TTL DATA 7-12

PACKAGE OUTLINES PLCC (continued) Case 779-02 FN Suffix 68-Pin Plastic -N- Y BRK D B 0.18 (0.007) M T N S –P S L S –M S -M- U 0.18 (0.007) M T N S –P S L S –M S -L- 68 LEADS W Z1 ACTUAL 68 D -P- 1 G1 0.25 (0.010) M T N S –P S L S –M S V H 0.18 (0.007) M T L S –M S N S –P S X 0.18 (0.007) M T N S –P S L S –M S VIEW D-D A 0.18 (0.007) M T L S –M S N S –P S Z R 0.18 (0.007) M T L S –M S N S –P S C E K1 K G 0.10 (0.004) G1 0.25 (0.010) S T L S –M S J -T- SEATING F 0.18 (0.007) M T L S –M S N S –P S DETAIL S 0.18 (0.007) M T N S –P S L S –M S PLANE DETAIL S N S –P S MILLIMETERS INCHES DIM MIN MAX MIN MAX A 25.02 25.27 0.985 0.995 NOTES: 1. DUE TO SPACE LIMITATION, CASE B 25.02 25.27 0.985 0.995 779-02 SHALL BE REPRESENTED BY A GENERAL (SMALLER) CASE OUTLINE C 4.20 4.57 0.165 0.180 DRAWING RATHER THAN SHOWING ALL 68 LEADS. E 2.29 2.79 0.090 0.110 2. DATUMS -L-, -M-, -N-, AND -P- DETERMINED WHERE TOP OF LEAD F 0.33 0.48 0.013 0.019 SHOULDER EXIT PLASTIC BODY AT MOLD PARTING LINE. G 1.27 BSC 0.050 BSC 3. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING H 0.66 0.81 0.026 0.032 PLANE. 4. DIM R AND U DO NOT INCLUDE MOLD J 0.51 — 0.020 — PROTRUSION. ALLOWABLE MOLD PROTRUSION IS 0.25 (0.010) PER SIDE. K 0.64 — 0.025 — 5. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. R 24.13 24.28 0.950 0.956 6. CONTROLLING DIMENSION: INCH. 7. 779-01 IS OBSOLETE, NEW STANDARD U 24.13 24.28 0.950 0.956 779-02. V 1.07 1.21 0.042 0.048 W 1.07 1.21 0.042 0.048 X 1.07 1.42 0.042 0.056 Y — 0.50 — 0.020 Z 2° 10° 2° 10° G1 23.12 23.62 0.910 0.930 K1 1.02 — 0.040 — Z1 2° 10° 2° 10° FAST AND LS TTL DATA 7-13

FAST AND LS TTL DATA 7-14